Bo Patel
Bo Patel began his career at Motorola where he worked in various senior level engineering and project management roles. Mr. Patel went on to run all facets of the RF/Advanced Technology Division at American Standard Circuits as the Executive Vice President. Mr. Patel ran operations, sales, R&D, and business development in his 6 years with the firm. While at American Standard Bo worked on several multimillion dollar joint development projects with companies including Northrup Grumman, Nortel Networks, M/A Com, Sirius Satellite Radio and a host of other large OEMs. Most recently, Mr. Patel has worked as a senior level investment banker in a strategic advisory and business development role helping start-up companies raise $3-$30M in capital. Bo blends his engineering experience and his operations background with his financial savvy to add value to the companies he assists.
Mr. Patel earned a Masters of Business Administration from Booth School of Business at the University of Chicago and Bachelors of Science in Materials Science & Engineering with a concentration in polymers from the University of Illinois Urbana-Champaign. Mr. Patel holds a Certificate in Lean Operations from the University of Illinois at Chicago as well. Bo also currently holds 3 patents in thermal management materials.
